Diamond Scriber OSM-90TS
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• Vision System using multiple cameras to ensure accurate auto alignment.
• Perform scribes by applying pressure on the sharp edge of a diamond tip tool.
• Remote access with TeamViewer and Windows PC.
• Dry process eliminates potential damage from liquid and coolants.
• Reproducible, repeatable and adjustable diamond pressure and speed.
• Virtually zero kerf allowing maximum die density.
• Original technology
• Custom Design or Stock item.
• Easy operation and menu set up.
• Low cost of ownership.
• Continuous scribe control using Touch-down position and pressure adjustment.
• Damage free mirror like surface resulting from micro cracks propagated by scribing.
•Table φ170 mm (For maximum 4 inches wafer)
• Parallel ±0.010 mm/100mm Travel
•Wafer Set 6-Inch Frame 2-6-1 (Disco Standard)
2. Z(Cutter Movement)45mm Pulse Motor
•Resolution 0.1μm
•Cutter Angle 55°±5°
•Force 5 ~ 40g
3. Optical System
• Microscope 4 Times ・ 1 CCD Camera
•1 Monitor 15” ・1 Vision Unit (KEYENCE) ・ 1 Scan Camera
•Each wafer or bar can be aligned automatically with the vision unit.
4. Cut Depth ・0 ~ 999μm
The tool is lowered in nμm from the wafer zero level
5. Cutter Force Indicator ・On Touch Screen
6. Utilities ・Power Supply AC100V 500VA
•Vacuum Factory Line
•Air Supply 4Kg/cm2 Φ6mm 2L/m
7. Size ・710(W) × 870(D) × 1415(H) mm
8. Weight ・ Approx. 350 Kg
9.Signal Tower ・ 3 Color status signal tour
Opto System Diamond Scriber OSM-90TS
Opto System Diamond Scriber OSM-90TS utilize a diamond tool to perform die or bar singulation as part of the scribe and break process. This high precision semiautomatic tool is popular for laser diode manufacturing.
The design includes a vision system that automatically recognize pattern structure and accurately align the wafer to the cut position. In addition, the machine incorporates a linear motor for accurate table movement and automatic force control of the diamond tip. These features ensure high quality facets, high yields and overall low cost of ownership. This machine can be used for a number of materials including Indium Phosphide and Gallium Arsenide substrates.
The design includes a vision system that automatically recognize pattern structure and accurately align the wafer to the cut position. In addition, the machine incorporates a linear motor for accurate table movement and automatic force control of the diamond tip. These features ensure high quality facets, high yields and overall low cost of ownership. This machine can be used for a number of materials including Indium Phosphide and Gallium Arsenide substrates.
Features
• Designed to support R & D and production environments.• Vision System using multiple cameras to ensure accurate auto alignment.
• Perform scribes by applying pressure on the sharp edge of a diamond tip tool.
• Remote access with TeamViewer and Windows PC.
• Dry process eliminates potential damage from liquid and coolants.
• Reproducible, repeatable and adjustable diamond pressure and speed.
• Virtually zero kerf allowing maximum die density.
• Original technology
• Custom Design or Stock item.
• Easy operation and menu set up.
• Low cost of ownership.
• Continuous scribe control using Touch-down position and pressure adjustment.
• Damage free mirror like surface resulting from micro cracks propagated by scribing.
Specification
1. Wafer Table •Table φ170 mm (For maximum 4 inches wafer)
• Parallel ±0.010 mm/100mm Travel
•Wafer Set 6-Inch Frame 2-6-1 (Disco Standard)
2. Z(Cutter Movement)45mm Pulse Motor
•Resolution 0.1μm
•Cutter Angle 55°±5°
•Force 5 ~ 40g
3. Optical System
• Microscope 4 Times ・ 1 CCD Camera
•1 Monitor 15” ・1 Vision Unit (KEYENCE) ・ 1 Scan Camera
•Each wafer or bar can be aligned automatically with the vision unit.
4. Cut Depth ・0 ~ 999μm
The tool is lowered in nμm from the wafer zero level
5. Cutter Force Indicator ・On Touch Screen
6. Utilities ・Power Supply AC100V 500VA
•Vacuum Factory Line
•Air Supply 4Kg/cm2 Φ6mm 2L/m
7. Size ・710(W) × 870(D) × 1415(H) mm
8. Weight ・ Approx. 350 Kg
9.Signal Tower ・ 3 Color status signal tour
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