Laser Diode Chip Tester VMS3300
LD Chip Tester VMS3300
The VMS3300 laser diode chip tester, commonly known as the Three-Stage VMS3300 is designed to automatically pick up LD chips from tape mounted on a ring at the supply table and transfer them to two temperature-controlled tables to perform LIV, FFP and wavelength test; before sorting the chips and finally transferring them to the array table to be placed on tape or Gel Pak according to preset criteria
. VMS3300 use two temperature-controlled tables to test chips at 25°C and 85°C in addition to a third table to conduct top and facets visual inspection.
This high precision chip testing machines includes a number of design features that allows accurate, robust and consistent opto-electrical characterization and sorting. Features includes a state-of-the-art vision system, scanning functions ,Test table positioning function and No Good (NG) management function with option to leave NG chips on supply ring, place measured chips on ring ,tape, Gel Pak or in a NG box.
. VMS3300 use two temperature-controlled tables to test chips at 25°C and 85°C in addition to a third table to conduct top and facets visual inspection.
This high precision chip testing machines includes a number of design features that allows accurate, robust and consistent opto-electrical characterization and sorting. Features includes a state-of-the-art vision system, scanning functions ,Test table positioning function and No Good (NG) management function with option to leave NG chips on supply ring, place measured chips on ring ,tape, Gel Pak or in a NG box.
Features
• Fully automatic testing and characterization of laser chips• Two independent temperature-controlled measurement tables to test chips at 25°C.and 85°C.
• Third table to conduct top and facets visual inspection.
• Optical output power and spectrum measurement at two different temperatures
• Automatic sorting and placement function for laser chips in different bins.
• Optical Character Recognition (OCR) for chip recognition
• Flexibility to include testing equipment or integrate customers testing equipment
• High Throughput due to design allowing parallel handling of multiple chips
• Flexible and Adjustable to handle laser for all applications from UV to IR
• Applicable for chips down to 150µm x 200µm lateral size & 100µm substrate thickness
• Easy operation and menu set up
Specification
1. Target Chip • Target Chip : LD Chip
• Chip Area Size : 100mm in Diameter
• Chip Size : W 0.2 to 0.4mm * L 0.2 to 0.3mm* T 0.1mm
2. Supply & Array Media
• Supply Media
Grip Ring for 4 Inch Wafer
Size : Ex. Diameter 152mm * In. Diameter140mm * Thickness 6mm
Pick-up Area : 100mm in Diameter
Number : 2
3. Array Media
• Grip Ring for 4 Inch Wafer
Size : Ex. Diameter 152mm * In. Diameter140mm * Thickness 6mm
Number : 4
• Gel Pak
Size : 2 inch
Number : 4
4. Machine Size: 2000(W) × 1500 (D) × 1400(H) mm
5. Machine Weight: Approx. 1400 Kg
6 Utility
• Power Supply: Three Phases AC 200V
• Power Consumption : 4KVA
• Air: Dry Air Factory Line / Dry Air 0.5Mpa 20L / min, Tube Diameter 6mm
• Vacuum: Factory Line or 90KPA 30L/min Tube Diameter 8mm
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