LED Probe & Sorter WMSS7000
LED Probe & Sorter WMSS7000
The WMSS7000 Semi-Automatic probing and sorting machine . measures the optical and electrical characteristics of expanded chips on tape and automatically arranges them on the output sheet according to the measurement results.
The results of the chips are classified into categories and automatically placed in arrays on the output ring or tray (optional). The maximum number of classifications on the ring is 3 while the maximum classification on the optional tray is 8.
The WMSS7000 incorporates LED Chip measuring, testing and classification in one machine while delivering high throughput test results. This Semi-Automatic probing and sorting machine is suitable for R&D and mass production and is popular with our customers worldwide.
The results of the chips are classified into categories and automatically placed in arrays on the output ring or tray (optional). The maximum number of classifications on the ring is 3 while the maximum classification on the optional tray is 8.
The WMSS7000 incorporates LED Chip measuring, testing and classification in one machine while delivering high throughput test results. This Semi-Automatic probing and sorting machine is suitable for R&D and mass production and is popular with our customers worldwide.
Features
• High-Speed probing and sorting of LED chips• High performance probing and sorting system
• High resolution defect detection
• Accurate electrical and optical measurement
• Chip alignment using high precision image processing
• Precise sorting and placement accuracy after electrical and optical inspection
• Measurement chips are classified into categories and placed in array on output ring or tray. 3 or 8 categories respectively
• Fast accurate probe needle replacement and adjustment
• Optical Character Recognition (OCR) for chip recognition
• High Throughput and robust design allowing probing and sorting in one machine
• Inspection mapping and Data display, handling of defective chips
• Easy operation and low cost of ownership
Specification
1. TARGET Wafer • Wafer Type :LED
• Wafer Size : 3 inches or less
• Chip Size : W: 0.15 to 0.5 mm L: 0.15 to 0.5 mm t: 0.08 to 0.5mm
2. TACT TIME (Including measurement )
• AVE: 1.45sec/piece or less (target)
3. TARGET WORKPIECE
• Work size at acceptance for inspection and start-up is as follows.
W: 0.17mm L: 0.17mm t: 0.12mm
4. Array Precision
• X and Y directions within ±30μm
• θ direction: within ±5°
5. MACHINE SIZE: 1732(W) × 1376(D) × 1950(H) mm
6. MACHINE WEIGHT: Approx. 1300 Kg
7. UTILITY
• Power Supply: Single phase AC 200V 50/60Hz 3.0KVA (except vacuum pump)
• Power Consumption : 3KVA
• Air: Dry Air Factory Line / Dry Air 0.5 MPA or more (φ10 one-touch coupling)
• Vacuum: Vacuum pump (2 units included) or Factory Line or 90KPA 30L/min Tube Diameter 8mm
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