Wafer Breaker WBS4000
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• Robust design to process hard substrates including Sic, GaN and Sapphire
• For Si and compound semiconductors including GaAs, InP, GaN
• Wafer size maximum 4 “ on an 8” frame
• High throughput using state of the art Keyence machine vision system
• Spring clamping method used to secure Ring to the work table
• Recipe Management: Each wafer model can be saved as a recipe. for future use
2. Machine Weight: 600 Kg
3. Wafer Size : 4 Inches
4. Chip Size : Minimum 200μm square or more, t=200μ or less
5. Air: Dry Air Factory Line / Dry Air 0.5 MPA
6. Power: AC :110V 500 VA
Wafer Breaker WBS4000
Semi-Auto Wafer Breaker WBS4000 is designed to break pre-scribed wafers into chips as part of the singulation process. The operator loads the ring with the scribed wafer to the work table and starts the machine to complete auto alignment and breaking of the wafer using pre saved recipes.The workpiece can be easily removed after the breaking process is completed.
The WBS4000 Wafer Breaker process wafers up to 4 “ on 6” frames and is particularly suited for thick hard wafers and a wide range of material including ceramic substrates such as Sapphire, SiC, Si3N4 along with Si and compound semiconductors such as GaAs, InP, GaN.
WBS4000 incorporates a number of design features to facilitate efficient high-volume breaking including wafer zero , wafer shape recognition, wafer alignment, break recognition, hammer and wafer holding function.
This flagship machine is one of our top sellers since our first offerings of back-end semiconductor processing machines in 1976 . The WBS4000 high productivity breaking machine is very popular among our customers worldwide.
The WBS4000 Wafer Breaker process wafers up to 4 “ on 6” frames and is particularly suited for thick hard wafers and a wide range of material including ceramic substrates such as Sapphire, SiC, Si3N4 along with Si and compound semiconductors such as GaAs, InP, GaN.
WBS4000 incorporates a number of design features to facilitate efficient high-volume breaking including wafer zero , wafer shape recognition, wafer alignment, break recognition, hammer and wafer holding function.
This flagship machine is one of our top sellers since our first offerings of back-end semiconductor processing machines in 1976 . The WBS4000 high productivity breaking machine is very popular among our customers worldwide.
Features
• Semi-automatic high precision breaking • Robust design to process hard substrates including Sic, GaN and Sapphire
• For Si and compound semiconductors including GaAs, InP, GaN
• Wafer size maximum 4 “ on an 8” frame
• High throughput using state of the art Keyence machine vision system
• Spring clamping method used to secure Ring to the work table
• Recipe Management: Each wafer model can be saved as a recipe. for future use
Specification
1. Machine Size: 810(W) × 1650(D) × 1650(H) mm 2. Machine Weight: 600 Kg
3. Wafer Size : 4 Inches
4. Chip Size : Minimum 200μm square or more, t=200μ or less
5. Air: Dry Air Factory Line / Dry Air 0.5 MPA
6. Power: AC :110V 500 VA
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