Transfer the laser diode chip which is expanded on a supply ring to the measurement stage to measure the item of IL / IR.
After that, the machine stores the tested bar onto an array ring.
|W||0.25 mm ～ 0.3 mm|
|L||0.25 mm ～ 0.6 mm|
|t||0.08 mm ～ 0.15 mm
Depending on the work specification, some work size above could not be met.
2.1 sec / P ( at 200 points measurement )
|Ring||φ120 mm x 20 mm|
|Array Number||2 sheets|
|Array Area||50 mm|
1 ring (sheet) for 1 rank ( max 2 bins )
Good 1 Rank ( NG chip is to NG Pocket )
Good 2 Rank ( NG chip is to NG Pocket )
To array all chips
(Array all the measured chips again in sequence.)
The emergency stop push button switches are installed.
The protection covers are assembled to prevent from pinching hands or fingers.
The auto operation can not be done while the cover is opened.
If the cover is opened during the auto operation, the machine will have one cycle stop.
The equipments above the machine (CRT etc.) are tightly fixed in order to avoid falling down at the earthquake.