Laser Diode Wafer Cleaver【 LDTH – 100TS 】
This machine cleaves the scribed LD wafer as the 1st cleaving process.
Its structure is to put a tensed tape onto the wafer from the upper side and move up the break blade from the lower side to cleave it.
Designed as a semi-auto type to align the wafer automatically by the vision system.
Specification
①Target Work

Wafer Size Within 4 inch

②Target Wafer Ring
Flat Ring

ID φ194 mm
OD φ228 mm
Thickness 1.2 mm

③Safety Solutions
A safety sensor with lock is installed on the front open / close door and the machine can not move when it’s opened.
The lock can not be released during the operation.