Its structure is to put a tensed tape onto the wafer from the upper side and move up the break blade from the lower side to cleave it.
Designed as a semi-auto type to align the wafer automatically by the vision system.
|Wafer Size||Within 4 inch|
②Target Wafer Ring
A safety sensor with lock is installed on the front open / close door and the machine can not move when it’s opened.
The lock can not be released during the operation.