LD Diamond Scriber【OSM-90TP】
This system puts scribe lines on a wafer in order to cleave it into chips at the post process.
With the lower camera function as an option, the alignment can be done by using the camera which is installed under the table.
The wafer table rotates in 90 degree so that the scribe of X / Y direction can be done.
The cutter unit is situated at the fixed position and the table side moves while scribing.