Perform the visual inspection on the top side / the emitting side (front and rear) of the laser diode chips which are placed in a supply ring.
NG chips are automatically removed during the auto operation.
② Elimination of the extra search process time
③ Inspection for the chips, arrayed at the forward process
④ Stability for the NG chip remove check
⑤ Realization of simple chip counter
Expanded Laser Diode Chips
|W||200 um ～ 280 um|
|L||300 um ～ 1500 um|
|t||100 um ± 20 um / 110 um ± 20 um|
75 mm x 95 mm