Perform the visual inspection on the top side / the emitting side (front and rear) of the laser diode bars which are supplied in a pocket tray.
Put a scratch mark on a NG chip and bring it back to the same pocket tray.
② Cavity corresponding width of the inspection table is 3 steps way and the table change is not necessary for the specified cavity size below.
③ By changing the transfer collet, this machine can handle the chip type material as well. The tact time will be longer, compared to the bar type.
|Cavity||250 um ～ 2000 um|
|Width||300 um ～ 800 um|
|Thickness||80 um ～ 200 um|
|Bar Length||5 mm ～ 15 mm
3 types of the inspection table will be initially prepared.
If the requested work size is except for above, other corresponding tables shall be purchased.
Diced chip of the specification above is the target one.
|Pickup From tray and Put it back to tray||Within 2 minutes / 1 laser diode bar
* If the scratch demand occurs over the inspection tact time, the tact time will be longer.