Breaker【OBM-90TP】
This machine cuts a scribed wafer into dice in dicing process.
Features
①Automatic algnment operation is possible by the addition of an image-processing unit.(Option)

②Cut position gap can be automatically adjusted.

③Diagonal or Penetration Lighting can be attached.(Option)

Specification
①Target Wafer
   4 inch or less
②Detecting Lens
   4 times magnification