②Wafer ring is automatically supplied and stored.
This machine is full-automatic that externals recognition and its alignment by image processer also are peformed automatically.
Thermal shock given to the material can be decreased and the processing that unlimitedly controls the debris be done.
800mm/sec in the scribing direction
★Coping with the warped wafer with the thickness variation
・Real time auto focusing function
・Focusing point sampling before scribing