Laser Scriber 【WSF6000X】
Sapphire・Gan・SiC・Crystal etc.
This machine makes grooves on the wafer by laser in the dicing process.
Features
①Auto alignment and focusing function can realize high quality scribing.

②Wafer ring is automatically supplied and stored.
This machine is full-automatic that externals recognition and its alignment by image processer also are peformed automatically.

Specification
★Debrisless Processing
Thermal shock given to the material can be decreased and the processing that unlimitedly controls the debris be done.

★High Throughput
800mm/sec in the scribing direction

★Coping with the warped wafer with the thickness variation
・Real time auto focusing function
・Focusing point sampling before scribing