This machine can pick up LED dice from the probed wafer which has already been cut and expanded , and place them on the tape allotted to the specific sorting rank in high speed operation.
②Dice are picked up rank by rank to realize constant high speed operation.
③A tape fully loaded is automatically exchanged with a new one.
④A tape does not need to be folded to set in the machine.
6 inch or less
0.20～1.0mm thickness: 0.15～0.3mm
④Max. ring accommodation
⑤Sorting magazine installation