Sorter【WDS5000R】Ring Array
Semi Auto LED Chip Array
This machine can pick up LED dice from the probed wafer which has already been cut and expanded , and place them on the tape allotted to the specific sorting rank in high speed operation.
Features
①Sorting Rank up to 100 can be accommodated.

②Dice are picked up rank by rank to realize constant high speed operation.

③A tape fully loaded is automatically exchanged with a new one.

④A tape does not need to be folded to set in the machine.

Specification
①Target Wafer
 6 inch or less

②Target Chip
 0.20~1.0mm thickness: 0.15~0.3mm

③Tact time
 300mmsec/chip

④Max. ring accommodation
 100 rings

⑤Sorting magazine installation
 4