Both wafers and chips can be inspected . Depending on the purpose and device,
vision system can be selected between standard CCD camera and special line sensor camera.
②A variety of devices is inspected such as LED , LD,VCSEL,PD,LCD,Themister,and Silicone etc.
③Vibration-proof structure is used for the steady inspection.
④Multiple image processors can be accomodated to realize high speed inspection.
②Auto Focus Unit
③High pixel color CCD camera
④NG Marking Unit
⑤NG Chip Removal Function
⑥Automatic Lighting Adjustment