Chip Sorter WDF4050R
Automatic Chip Sorter WDF4050R
WDF4050R Thermistor Chip Sorting machine is designed to use high-precision image processing and electrical characteristics data to automatically sort Thermistor semiconductor chips.
The machine automatically selects the dicer ring with the mounted singulated wafer from the magazine and transfers the ring to the supply table for expansion.
The supply table is equipped with an expansion mechanism that allows uniform expansion of the diced wafer.
After expansion; high resolution cameras are used to capture image of each chip and used to analyze its shape ,color and size. All Thermistor Chips are pre-tested in a Testing machine with a resistance meter for proper resistance value at 23°C±2°C and the results mapped.
The Thermistor Chip sorter utilize the wafer map data and image data for statistical process control .This information is used to show the scatter of chip type and performance and is used to sort and place chips in different bins by ranks ; based on their resistance and other predetermined classification.
The machine automatically selects the dicer ring with the mounted singulated wafer from the magazine and transfers the ring to the supply table for expansion.
The supply table is equipped with an expansion mechanism that allows uniform expansion of the diced wafer.
After expansion; high resolution cameras are used to capture image of each chip and used to analyze its shape ,color and size. All Thermistor Chips are pre-tested in a Testing machine with a resistance meter for proper resistance value at 23°C±2°C and the results mapped.
The Thermistor Chip sorter utilize the wafer map data and image data for statistical process control .This information is used to show the scatter of chip type and performance and is used to sort and place chips in different bins by ranks ; based on their resistance and other predetermined classification.
Features
• Fully automatic chip sorting and accurate placement of chips• Simplified switch operation and PC screen for easy manual operation and setting
• Two rank classification .The number of classifications is 1 or 2 ranks
• Twenty four (24) Bins
• Equipped with teaching function to automatically detect the optimal height of the collet
• Static eliminator blower to remove static electricity
• Utilize wafer map data for sorting and statistical process control
• Supply table expansion mechanism for high-precision image processing
• High productivity robust machine suitable for R&D and high volume manufacturing
• Low cost of ownership
Specification
1. TARGET Work o Target Chip : NTC thermistors
o Wafer Size : 3 inch
o Chip Size : 0.40mm x 0.20 mm x 0.10mm to 1.61mm x 0.81 mm x 0.25mm
o Speed : 0.4 sec per chip
2. MACHINE SIZE: 1370(W) × 1550(D) × 2320(H) mm
3. MACHINE WEIGHT: Approx. 1500 KG
4. UTILITY
• Power Supply: Three Phases AC 200V-15%~+10% 50/60Hz
• Power Consumption : 3KVA
• Air: Dry Air Factory Line / Dry Air 0.5Mpa -0.7MPa 20L / min, Tube diameter φ8mm
• Vacuum: Factory Line /Vacuum pump (accessory)-92kPa 20L/min Tube dia φ10mm
• Operating environment: 23°C±2°C, humidity 60%RH or less, no corrosive gas.
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