Chip Sorter WDS5050R

The WDS5050R semi-automatic chip sorter separates good chips from bad chips based on their electrical characteristics .This is an essential process in back-end semiconductor processing as it helps ensure that only good quality and reliable chips are selected for the final product.
The semi-automatic chip sorter combines manual and automatic process. The operator sets the grip ring with the mounted expanded wafer on the supply table before starting the machine to automatically perform θ alignment correction , scanning of chip coordinates and arranging the chips in arrays on output sheet rings based on comparison with the pre-ranked data.
This versatile high-speed inspection and sorting machine is designed to handle wafers up to 6 “ and is suitable for processing a number of semiconductor materials and chips including GaAs, GaAlAs, GaAllnp, GaP , GaN ,LED chip ,Laser Diode and Flip Chip.
WDS5050R semi-automatic chip sorter is suitable for R&D and mass production and is popular with our customers worldwide.

Features

• Fully automatic defect inspection and sorting of chips
• Easy collet replacement and excellent position repeatability after installation
• Robust Chip handling features to detect ,mark and reject defective dies
• High-speed pick and place - inspection and sorting machine
• Applicable to multiple chip types : GaAlAs, GaAllnp, GaP GaN ,LED chip ,Laser Diode and Flip Chip
• Sorts wafer chips based on predetermined criteria
• Automatic sorting and placement function for chips in array on sheet rings
• High Throughput due to design incorporating robust efficient high speed vision system, scanning and automated handling
• Flexible and Adjustable to handle wafer up to 6”
• Easy operation and menu set up

Specification

1. TARGET Wafer
• Wafer Type : GaAs, GaAlAs, GaAllnp, GaP, LED chips, Laser Diode ,Flip Chip etc.
• Wafer Size : 6 inches or less
• Chip Size : 0.15 to 1.0mm□ t0.15 to 0.3mm
2. TACT TIME
• 1.0 sec/chip or less
*This is the 　operation time from the start of automatic operation to the end of operation and operator call.
3. TARGET WORKPIECE AND RING
• Tip Thickness 0.11mm : min □3mm ～ max □10mm Thickness 0.11mm
• Supply ring DTF2-8-1 : Dicer ring DTF2-8-1 OD 261mm / ID 250mm / W 276mm / TH 1.2mm
　　　　　　　　　The product shall be supplied by the customer.
• Pickup area □150mm (or Φ210mm)
• Array area 190mm x 244mm on A4 carrier sheet supplied by the customer　
4. MACHINE SIZE: 1680(W) × 1188(D) × 1640(H) mm
5. MACHINE WEIGHT: Approx. 1000 Kg
6. UTILITY
• Power Supply: Three Phases AC 220V
• Power Consumption : 3KVA
• Air: Dry Air Factory Line / Dry Air 0.5Mpa 20L / min, Tube Diameter 6mm
• Vacuum: Vacuum pump (2 units included) or Factory Line or 90KPA 30L/min Tube Diameter 8mm

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