Laser Scriber WSF6000

Fully Automatic Laser Scriber WSF6000

The Fully Automatic WSF6000 Laser Scriber is designed to scribe wafers up to 6” on an 8” frame as part of the scribe and break singulation process.
The machine is equipped with a 355 nm laser that efficiently scribes Sapphire, GaN or Si wafers to be cleaved into bars or chips. The design includes a vision system with automatic functions that accurately moves wafers to the cut position. In addition, the machine incorporates numerous features to ensure high performance, safety and low cost of ownership.

Features

• Fully Automatic operation including automatic ring loading and unloading
• Vision System using multiple cameras to ensure accurate auto alignment
• High throughput using state of the art vision system
• Performs precision thermal abrasing scribing using laser beams
• High accuracy scribing using auto alignment and auto focusing function
• Broken line scribing and marking using high speed shutter
• Robust safety features including safety shields and detectors
• Remote access with TeamViewer and Windows PC
• Virtually zero kerf allowing maximum die density
• Wafer size maximum 6 “ on an 8” frame
• Custom Design or Stock item
• Easy operation and menu set up
• Low cost of ownership
• 20x amplification camera for device alignment.

Specification

1. Machine Width: 1500 mm
2. Machine Height: 1900 mm
3. Machine Length: 1500 mm
4. Machine Weight : 1100 kg
5.Wafer Size : 6 inches
6.Chip Size : Minimum 150μm
7.Power: AC :100V 1.2 KVA
8.Speed: Maximum 100 mm/sec
9.Resolution: 0.001mm
10.Vacuum Pump : Factory Supply

For questions or additional specifications – Please complete and submit the Product Inquiry Form below:

Product Inquiry Form

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