LD Breaker LDH 100TSX
Laser Diode Breaker LDH 100TSX
The LDH-100TSX Breaker cleaves pre-scribed laser diode bars into chips. This semi-automatic machine is equipped with a vision system that automatically align each bar before cleaving.
Protection film is place over the scribed surface of the laser diode bars before cleaving. The ring supporting the substrate is placed scribed line facing down on the holder of the support table.
The table is designed with a support unit that opens up in the center using an adjustable gap This allows the vision system to recognize the structure and accurately align the bar to the blade before cleaving the substrate from the back. Multiple bars can be cut using a long blade in the batch mode.
This versatile breaker is used to process wafers up to 4 inches. The machine is used to process a wide range of substrates including Si and semiconductors such as GaAs,InP and GaN
This versatile breaker is used to process wafers up to 4 inches. The machine is used to process a wide range of substrates including Si and semiconductors such as GaAs,InP and GaN
Features
• Semi-automatic high precision breaking• Robust design to process Si and compound semiconductors including GaAs, InP, GaN
• High throughput using state of the art vision system
• Multiple bars can be cut by a long blade in the batch mode
• Bars are automatically aligned before and during operation
• A monochrome camera is installed under the support gap for accurate alignment
• Recipe Management: Each wafer model can be saved as a recipe. for future use
• TeamViewer remote access
Specification
1.Machine Width: 1300 mm 2. Machine Height: 1400 mm
3. Machine Length: 890 mm
4. Machine Weight : 800kg
5.Wafer Size : 4 inches
6.Chip Size : Minimum 200μm
7.Power: AC :12V 1 KVA
8.Speed: Maximum 50mm/sec
9.Resolution: 0.001mm
10.Vacuum Pump : Factory Supply
11.Auto Loader: Option
Product Inquiry Form