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Breaker

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  9. LD Breaker LDH 100TSX
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LD Breaker LDH 100TSX

Laser Diode Breaker LDH 100TSX
The LDH-100TSX Breaker cleaves pre-scribed laser diode bars into chips. This semi-automatic machine is equipped with a vision system that automatically align each bar before cleaving. Protection film is place over the scribed surface of the laser diode bars before cleaving. The ring supporting the substrate is placed scribed line facing down on the holder of the support table. The table is designed with a support unit that opens up in the center using an adjustable gap This allows the vision system to recognize the structure and accurately align the bar to the blade before cleaving the substrate from the back. Multiple bars can be cut using a long blade in the batch mode. 
This versatile breaker is used to process wafers up to 4 inches. The machine is used to process a wide range of substrates including Si and semiconductors such as GaAs,InP and GaN 
Features
• Semi-automatic high precision breaking
• Robust design to process Si and compound semiconductors including GaAs, InP, GaN
• High throughput using state of the art vision system
• Multiple bars can be cut by a long blade in the batch mode
• Bars are automatically aligned before and during operation
• A monochrome camera is installed under the support gap for accurate alignment
• Recipe Management: Each wafer model can be saved as a recipe. for future use
• TeamViewer remote access
Specification
1.Machine Width:  1300 mm  
2. Machine Height: 1400 mm  
3. Machine Length: 890 mm 
4. Machine Weight : 800kg 
5.Wafer Size : 4 inches
6.Chip Size : Minimum 200μm
7.Power: AC :12V 1 KVA
8.Speed: Maximum 50mm/sec
9.Resolution: 0.001mm
10.Vacuum Pump : Factory Supply
11.Auto Loader: Option
For questions or additional specifications – Please complete and submit the Product Inquiry Form below:
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    Privacy Policy

    Opto System Co., Ltd respect and comply with the laws and social order related to the Personal Information Protection Law, and strive to properly handle, protect, and manage personal information related to our customers in accordance with the following policy.

    1.Purpose of Collecting Personal Information
    Our company will use your personal information for the following purposes
    (1) To fulfill inquiries and provide related information, services, and post-contract after-sales services.
    (2) Provision of personal information to third parties within the scope of achieving the purpose of use described in (1).
    (3) Provision of product information and services handled by the Company.
    (4) Introduction of products, services, etc. of our business partners that are considered useful to customers.
    (5)Sales activities and marketing activities (questionnaire requests, campaigns, etc.) by mail, telephone, e-mail, etc. for the provision of products, information, and services described in (1), (3), and (4). Customer trend analysis or research and analysis of product development, etc.
    The provision of information and services will be withdrawn upon request from the concerned individual.

    2.Types of Information to be Collected
    The information collected will mainly consist of the following personal information
    -Name - Gender - Date of birth (Age)
    - Home address - Home telephone and fax numbers
    --Other information requested on application forms, contracts, questionnaires, etc. (Customer's occupation, Name and Address for campaign applications and Prize delivery, Questionnaire responses, Opinions, and Information necessary when making inquiries).
    This information will be used for the purposes of collecting the above personal information.

    3.Information Management Methods
    Our company will always take appropriate measures to ensure that customer information is accurate and up-to-date. In addition, Company will take appropriate measures (organizational, personnel, physical, and technical measures) to properly manage our customers' personal information to prevent leakage, loss, or damage, and will audit and review the status of management. Company outsources part of the handling of personal information to outside contractors who are deemed to handle personal information appropriately. The subcontractor uses personal information only to the extent necessary to perform the subcontracted work.

    4.Provision and Sharing of Personal Information with Third Parties
    Our company will not disclose, provide, sell, or share customers personal information
    That company collect with third parties.

    5.Requests for Disclosure, Correction, or Discontinuance of use from customers
    (Disclosure and Correction)
    When Our company will receive a request from a customer to disclose information about himself/herself, we will respond to the request after confirming the customer's identity, unless there is a special reason not to do so. In addition, if the information company have about you is inaccurate, we will change the information to be accurate.
    (Suspension of Use)
    If any customer does not wish our company to use or provide their personal information to third parties, please contact us at the address below.
    However, as a result of the suspension of use or provision to third parties, the provision of information services may become unavailable.

    6.About Changes
    If there are any significant changes to the above information, a new notice will be issued. For the latest information, please contact us at the following address.

    7.For Inquiries, Please Contact
     Opto Systems Co., Ltd.
     100 Miyamaki Nogami, Kyotanabe-shi, Kyoto 610-0313, Japan
     TEL: 07774-68-4441

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    For product consultation and inquiries
    business hours/weekday 9:00~17:00
    local_phone +81-774-68-4441local_phone +81-774-68-4441
    mail_outline Inquiries
    Opto System Co., Ltd.
    〒610-0313
    100 Miyamakinogami, Kyotanabe City, Kyoto Prefecture
    TEL +81-774-68-4441TEL +81-774-68-4441 FAX +81-774-68-4444
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