Laser Diode Chip Tester VMS3100
LD Chip Tester VMS3100
The VMS3100 laser diode chip tester, commonly known as the Single Stage VMS3100 is designed to automatically pick up LD chips from tape and transfer them to a temperature-controlled chuck to perform LIV, FFP and wavelength test; before sorting the chips and placing them on tape or Gel Pak according to preset criteria
VMS3100 utilize a single temperature-controlled table to test chips at 25°C.
This high precision chip testing machines includes a number of design features that allows accurate, robust and consistent opto-electrical characterization and sorting. Features includes a state-of-the-art vision system, scanning functions ,Test table positioning function and No Good (NG) management function with option to leave NG chips on supply ring, place measured chips on ring ,tape, Gel Pak or in a NG box
VMS3100 utilize a single temperature-controlled table to test chips at 25°C.
This high precision chip testing machines includes a number of design features that allows accurate, robust and consistent opto-electrical characterization and sorting. Features includes a state-of-the-art vision system, scanning functions ,Test table positioning function and No Good (NG) management function with option to leave NG chips on supply ring, place measured chips on ring ,tape, Gel Pak or in a NG box
Features
• Fully automatic testing and characterization of laser chips• Utilize a single temperature-controlled table to test chips at 25°C
• Optical output power and spectrum measurement at one temperature
• Automatic sorting and placement function for laser chips in different bins
• Optical Character Recognition (OCR) for chip recognition
• Flexibility to include testing equipment or integrate customers testing equipment
• High Throughput due to design allowing parallel handling of multiple chips
• Flexible and Adjustable to handle laser for all applications from UV to IR
• Applicable for chips down to 150µm x 200µm lateral size & 100µm substrate thickness
• Easy operation and menu set up
Specification
1.Target Chip • Target Chip : LD Chip
• Chip Area Size : 100mm in Diameter
• Chip Size : W 0.2 to 0.4mm * L 0.2 to 0.3mm* T 0.1mm
2. Supply & Array Media
• Supply Media
Grip Ring for 4 Inch Wafer
Size : Ex. Diameter 152mm * In. Diameter140mm * Thickness 6mm
Pick-up Area : 100mm in Diameter
Number : 2
3. Array Media
• Grip Ring for 4 Inch Wafer
Size : Ex. Diameter 152mm * In. Diameter140mm * Thickness 6mm
Number : 4
• Gel Pak
Size : 2 inch
Number : 4
4. Machine Size : 2000(W) × 1500(D) × 1400(H) mm
5. Machine Weight : Approx. 1400 Kg
6. Utility
• Power Supply: Three Phases AC 200V
• Power Consumption : 4KVA
• Air: Dry Air Factory Line / Dry Air 0.5Mpa 20L / min, Tube Diameter 6mm
• Vacuum: Factory Line or 90KPA 30L/min Tube Diameter 8mm
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