Laser Diode Cleaver LDH-30TS
Opto System Cleaver LDH-30TS
Opto System LDH-30TS cleaves pre-scribed laser diode bars into chips. This semi-automatic machine is equipped with a vision system that automatically align each bar before cleaving. The ring supporting the substrate is placed upside down on the holder; this allows the vision system to recognize the structure and accurately align the bar to the blade before cleaving the substrate from the back.
The metal support unit is designed with four grooves with different width, the appropriate groove is used each time to ensure the optimum performed on each product.
The combination of these and other features ensures high quality mirror like facets, high yields, reliable machine performance and overall low cost of ownership. This machine can be used for a number of materials including InP and GaAs substrates.
The combination of these and other features ensures high quality mirror like facets, high yields, reliable machine performance and overall low cost of ownership. This machine can be used for a number of materials including InP and GaAs substrates.
Features
• Robust design, low maintenance, reliable high-performance machine • High precision/Versatile tool for R&D and Production environments
• Semi-Automatic operation mode
• Parameter saving and retrieval function for R&D and qualified production recipe
• Support Unit with a range of groove width to facilitate bending angle control
• Vision System using multiple cameras to ensure accurate auto alignment
• Remote access with TeamViewer
• Windows 10 PC ,15” monitor and touch screen.
• Custom Design or Stock item
• Easy operation and menu set up
• Low cost of ownership
• Three-point fixture for precision alignment and cleaving
• Continuous cleave control using adjustable pressure and touch-down position function
Specification
1. LD Work ・Area Size 50mm x 50mm
・Chip Size Minimum 200 μm
・Wafer Set 8-Inch Frame (Disco Standard)
2. Frame Holder (θ Axis)
・Rotation 0°/ 90° Pulse Motor/Pulley
・Accuracy ±0.02°
・Frame Spring Clamp Fixture
3. X-Y Axis
・Servo/Ball Screw Drive
・Speed Maximum 40mm/sec
・Accuracy ±0.005mm
4. Support Unit
•Metal Type
• Groove fixed width type. With 4 grooves per support
5. Optical System/Vision Unit
・ High Magnification Camera located under the support
・ Low Magnification Camera located above the frame
6. Utilities ・Power Supply AC100V 500VA
7. Size ・730(W) × 850(D) × 1475(H) mm
8. Weight ・ Approx. 400 Kg
9.Signal Tower ・ 3 Color status signal tour
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