LD Die VI Sorter VVSP4000
Laser Diode Die VI SorterVVSP4000
Opto System fully automatic VVSP4000 die inspection sorter is designed to perform visual inspection of both the top side and facets of laser diode chips.
The machine picks up the singulated laser bars from tape, takes high resolution pictures of the p-side and both facets , sorts out the working DFB laser chips on each bar, before placing them back on either tape or gel pack. The machine includes an additional option to inspect the bottom side of the chips if required.
The visual inspection takes place in a dedicated vibration-free inspection stage that increases resolution down to 1µm defect size recognition. The VVSP4000 inspection sorter will recognize the laser ID number and includes a feature to record an image of each laser for reference. This high throughput state of the art machine provides a consistent, repeatable process and accurate results that allows wafer batch quality tracking as part of a full audit trail.
Features
• Fully Automatic high precision optical inspection and sorting• Vision System using multiple cameras to ensure accurate auto alignment
• High throughput using state of the art vision system
• Optical inspection of both facets, the top side and optional bottom side
• Ability to Sort good dies and bad dies in different locations
• Option to record an image of each laser for reference
• Dedicated inspection stage that captures defects down to 1µm size
• The process is repeatable and consistent, with a full audit trail
• Laser ID number is recognized
• Ability to record an image of each laser for reference
• Wafer batch quality can be tracked
• Bin data are transferred to this sorter through the OCR function
• TeamViewer remote access
Specification
1. Width: 1300 mm 2. Height: 1800 mm
3. Length: 1600 mm
4. Weight : 1500 kg
5. Power: AC :230V 3 KVA
6. Chip Size : LD Bar Chip :250um (width) × 250um (cavity) × 150um (thickness)
7. Tact time : 5 sec/chip
8. Min defect size: 4µm for Top and 2 µm for Facets
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