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Product Info

Cleaver

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  9. Laser Diode Tape Cleaver LDTH 100TS
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Laser Diode Tape Cleaver LDTH 100TS

Laser Diode Tape Cleaver LDTH 100TS
Opto System LDTH 100TS laser diode tape cleaver is designed and optimized to cleave pre-scribed GaAs and InP laser diode wafers up to 4 inches.
The machine features our original designed tension stretched tape cleaving method, where the tensioned tape is pushed against the top of the wafer and the ceramic cleaving blade is pushed up from the bottom.
The frame supporting the substrate to be cleaved is placed in the machine. A stretched tape covers the structures from above and hold them in place. The machine vision system automatically recognizes the structures and accurately aligns the wafer to the ceramic cutter that hits the substrate from the bottom.
The combination of the sharp bending force and the tight flexible support of the tape ensure successful propagation of the pre-scribed lines along the crystal planes without creating any adjacent damage .This result in the consistent production mirror-like facets.
Features
• Full-automatic operation mode
• Robust design to process Si and compound semiconductors including GaAs and InP
• High throughput using state of the art Keyence vision system
• Original design tension stretched tape cleaving method
• Cleave Cells into Bars with perfect mirror facets
• Ceramic blade used to cleave the laser bars
• Wafer Size: up to 4” wafers on 6” frames
• TeamViewer remote access
Specification
1. Width: 850 mm
2. Length: 750 mm
3. Height: 1475 mm
4. Weight : 300kg
5. Wafer Size : 4 inches
6. Chip Size : Minimum 200μm
7. Power: AC : 100V 0.5 KVA
8. Speed: Maximum 300mm/sec
9. Resolution: 0.001mm
For questions or additional specifications – Please complete and submit the Product Inquiry Form below:
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    Privacy Policy

    Opto System Co., Ltd respect and comply with the laws and social order related to the Personal Information Protection Law, and strive to properly handle, protect, and manage personal information related to our customers in accordance with the following policy.

    1.Purpose of Collecting Personal Information
    Our company will use your personal information for the following purposes
    (1) To fulfill inquiries and provide related information, services, and post-contract after-sales services.
    (2) Provision of personal information to third parties within the scope of achieving the purpose of use described in (1).
    (3) Provision of product information and services handled by the Company.
    (4) Introduction of products, services, etc. of our business partners that are considered useful to customers.
    (5)Sales activities and marketing activities (questionnaire requests, campaigns, etc.) by mail, telephone, e-mail, etc. for the provision of products, information, and services described in (1), (3), and (4). Customer trend analysis or research and analysis of product development, etc.
    The provision of information and services will be withdrawn upon request from the concerned individual.

    2.Types of Information to be Collected
    The information collected will mainly consist of the following personal information
    -Name - Gender - Date of birth (Age)
    - Home address - Home telephone and fax numbers
    --Other information requested on application forms, contracts, questionnaires, etc. (Customer's occupation, Name and Address for campaign applications and Prize delivery, Questionnaire responses, Opinions, and Information necessary when making inquiries).
    This information will be used for the purposes of collecting the above personal information.

    3.Information Management Methods
    Our company will always take appropriate measures to ensure that customer information is accurate and up-to-date. In addition, Company will take appropriate measures (organizational, personnel, physical, and technical measures) to properly manage our customers' personal information to prevent leakage, loss, or damage, and will audit and review the status of management. Company outsources part of the handling of personal information to outside contractors who are deemed to handle personal information appropriately. The subcontractor uses personal information only to the extent necessary to perform the subcontracted work.

    4.Provision and Sharing of Personal Information with Third Parties
    Our company will not disclose, provide, sell, or share customers personal information
    That company collect with third parties.

    5.Requests for Disclosure, Correction, or Discontinuance of use from customers
    (Disclosure and Correction)
    When Our company will receive a request from a customer to disclose information about himself/herself, we will respond to the request after confirming the customer's identity, unless there is a special reason not to do so. In addition, if the information company have about you is inaccurate, we will change the information to be accurate.
    (Suspension of Use)
    If any customer does not wish our company to use or provide their personal information to third parties, please contact us at the address below.
    However, as a result of the suspension of use or provision to third parties, the provision of information services may become unavailable.

    6.About Changes
    If there are any significant changes to the above information, a new notice will be issued. For the latest information, please contact us at the following address.

    7.For Inquiries, Please Contact
     Opto Systems Co., Ltd.
     100 Miyamaki Nogami, Kyotanabe-shi, Kyoto 610-0313, Japan
     TEL: 07774-68-4441

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    For product consultation and inquiries
    business hours/weekday 9:00~17:00
    local_phone +81-774-68-4441local_phone +81-774-68-4441
    mail_outline Inquiries
    Opto System Co., Ltd.
    〒610-0313
    100 Miyamakinogami, Kyotanabe City, Kyoto Prefecture
    TEL +81-774-68-4441TEL +81-774-68-4441 FAX +81-774-68-4444
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