Visual Inspection Machine VVF4000
Visual Inspection Machine VVF4000
The VVF4000 Automated Optical Inspection (AOI) Machine is designed to complete high volume visual inspection ‘of wafers or chips mounted on tape, without the need or requirement to pick and place.
The AOI VVF4000 performs 100% optical inspection of the top side and both facets with an option to inspect the bottom side.
The machine includes a number of design features including two separate stages for parallel device inspection and increased throughput. A magazine where the frames with the mounted device are automatically drawn, inspected and returned. In addition to fast generation of maps of good and defective devices. Optical Character Recognition (OCR) technology is utilized to identify the lot data and incorporates this information into the results. VVSP4000 is the ideal machine for optical inspection if sorting is not required as it consistently delivers high volumes accurate inspection with low cost of ownership.
The AOI VVF4000 performs 100% optical inspection of the top side and both facets with an option to inspect the bottom side.
The machine includes a number of design features including two separate stages for parallel device inspection and increased throughput. A magazine where the frames with the mounted device are automatically drawn, inspected and returned. In addition to fast generation of maps of good and defective devices. Optical Character Recognition (OCR) technology is utilized to identify the lot data and incorporates this information into the results. VVSP4000 is the ideal machine for optical inspection if sorting is not required as it consistently delivers high volumes accurate inspection with low cost of ownership.
Features
• Fully Automatic high precision optical inspection• Inspection on tape with no pick and place
• Fast delivery of map of good and defective devices -1.8 sec per chip
• Optical inspection of both facets, the top side and optional bottom side
• Wafers, Bars and Chips can be inspected
• Two stages for High Throughput.(Parallel device inspection)
• Automatically load and return frames to magazine
• Ability to detect defects down to 1µm on both facets without picking up the devices
• High throughput using state of the art vision system
• OCR technology identifies the lot data and incorporates this information into the results
Specification
1. Machine Width: 1920 mm 2. Machine Height: 1990 mm
3. Machine Length: 2000 mm
4. Machine Weight : 3000 kg
5. Power: 110V / 60Hz or 230V / 50 Hz Local electrical power
6. Placement: Devices placed within 70x70mm area on tape
7. Frame Size : 6′ Frames or Grip Rings
8. Tact time : 1.8 sec/chip
9. Min defect size: 1µm
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