Wafer Breaker WBS8000

The Opto System 8 inch Semi-Auto Wafer Breaker WBS8000 breaks pre-scribed wafers into chips as part of the singulation process. In this system, the operator supplies/loads a ring with a scribed wafer to the work table. The alignment and breaking operation of the wafer is completed automatically in the X and Y after loading .The workpiece is taken out after the braking process is completed.
This versatile machine is designed to process wafers up to 8 “ on 12” frames. In addition, it incorporates a number of designed features including wafer zero , wafer shape recognition, wafer alignment, break recognition, hammer and wafer holding function to facilitate efficient high-volume breaking.
The robust design enables the successful singulation of hard substrates including Sapphire, GaN. and Si.

Features

• Semi-automatic high precision breaking
• Robust design to process hard substrates including Sic, GaN and Sapphire
• Wafer size maximum 8 “ on a 12” frame
• High throughput using state of the art Keyence machine vision system
• Spring clamping method used to secure Ring to the work table
• Recipe Management: Each wafer model can be saved as a recipe. for future use

Specification

1. Machine size: Width 1000 mm, Height: 1550 mm,Length1270 mm
2. Wafer Size : 8 inches
3. Chip Size : Minimum 200μm square or more, t=200μ or less
4. Speed: Maximum 50mm/sec
5. Machine Weight : 400kg
　 6. Resolution: 0.001mm
7. Power: AC :110V 1 KVA

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