Wafer Prober WPF4000
Wafer Prober WPF4000
The Fully Automatic WPF4000 Wafer Prober is an integral tool for back-end semiconductor processing.
The machine is designed to automatically conduct electrical test of each die on the wafer to determine the overall quality and functionality of the wafer.
The WPF4000 Prober is capable of handling wafers up to 4” in diameter. The prober use probe needles to contact the chips from the top and electrically characterize all chips. If both contacts(connection pads) are on the top, the chips can remain on the tape this allows the vision system to accurately align and monitor the measurement. If one contact is on the bottom, the chips are accurately transferred to a wafer chuck to complete the electrical test. The machine design can integrate customers existing testing equipment or we can recommend and include testing system to meet customers requirement. WPF4000 consistently achieve high productivity , precise placement ,excellent contact performance and high-speed control. This is suitable for mass production manufacturing environment.
The machine is designed to automatically conduct electrical test of each die on the wafer to determine the overall quality and functionality of the wafer.
The WPF4000 Prober is capable of handling wafers up to 4” in diameter. The prober use probe needles to contact the chips from the top and electrically characterize all chips. If both contacts(connection pads) are on the top, the chips can remain on the tape this allows the vision system to accurately align and monitor the measurement. If one contact is on the bottom, the chips are accurately transferred to a wafer chuck to complete the electrical test. The machine design can integrate customers existing testing equipment or we can recommend and include testing system to meet customers requirement. WPF4000 consistently achieve high productivity , precise placement ,excellent contact performance and high-speed control. This is suitable for mass production manufacturing environment.
Features
• Fully automatic electrical testing and characterization of chips on tape• Tester used to process the data from the wafer probed and provide the probing results
• Integration of testing equipment with precise alignment of chips and prober needles
• Flexibility to include testing equipment or integrate customers testing equipment
• State of the art vision system
• High productivity , precise placement ,excellent contact performance and high-speed control
• High precision ,robust and dependable tool for high-yield mass production
• Flexible tool for R&D. Statistical big data can be acquired in minutes
• Used for Bulk Acoustic Wave (BAW) and Surface Acoustic Wave (SAW) filter probing
• Applicable for LED testing and VCSEL diode chip characterization
• TeamViewer remote access
Specification
1. TARGET WAFER • Target Wafer : Many kinds of chips: SAW Filters, LEDs, VCSELs…
• Wafer Size : 4 inch
• Measurement area Ø150mm on taped frame.
2. TACT TIME
• Throughput: 2.5sec/chip
• Mechanical Index Time: 200msec/0.3mm
• Measurement time: 1.0sec or less
3. MACHINE SIZE: 1140(W) × 1110(D) × 1750(H) mm
4. MACHINE WEIGHT: Approx. 1400 Kg
5. UTILITY
• Power Supply: AC 100V 50/60Hz
• Power consumption: 1.5kVA (main unit only)
• Air source: Factory line 4~7kg/cm2,
• Tube outer diameter φ8mm: Dry air (for condensation countermeasures) 4~7kg/cm2, tube outer diameter φ8mm
When using a measurement stage of 20°C or less, about MAX100L/min is required.
• Vacuum source: Vacuum pump tube outer diameter φ8mm
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